KS-nP 1.27mm Pitch DIP Switch Surace Mount
This ultra-compact DIP switch series is designed for modern, high-density surface-mount technology (SMT) applications where board space is at a premium. It is distinguished by its fine 1.27mm (0.05″) pin pitch, effectively halving the footprint of traditional 2.54mm DIP switches and enabling significant space savings on densely populated PCBs. Each switch element is a SPST (Single-Pole, Single-Throw) device, providing straightforward on/off control for circuit configuration.
Actuation is achieved via slide actuators, offering a familiar and positive user interface. These actuators are designed to be flush with the switch body profile, creating a low, smooth top surface. This design is critical for applications where components must pass safely over the switch during automated assembly or final product assembly, preventing snagging and ensuring compatibility with pick-and-place processes and automated test fixtures.
The series is offered in a versatile range from 2 to 12 positions, providing flexible configuration options for address selection, mode setting, or feature enabling in compact devices. It is electrically rated for DC 24V at 25mA, making it suitable for low-power digital signal and logic-level applications.
As a true surface-mount device, it is supplied in tape-and-reel packaging for compatibility with high-speed automated assembly lines. Its precisely controlled dimensions and gull-wing lead design ensure excellent solderability and reliable board attachment during reflow soldering.
This series is engineered as a direct form, fit, and function equivalent to leading industry-standard components. It offers excellent compatibility and serves as a reliable alternative to the E-Switch KAN Series (e.g., KAN1102RT, KAN1106RT), the CUI Devices Same Sky DS05-127 series, the C&K TDA Series (e.g., TDA02H0SB1R, TDA04H0SB1R), and the Würth Elektronik WS-DISV series. This broad cross-compatibility ensures easy design-in and secondary sourcing for applications in telecommunications infrastructure, networking hardware, industrial control modules, and advanced consumer electronics where miniaturization and automated manufacturability are paramount.














